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author | Jay Vosburgh <fubar@us.ibm.com> | 2007-01-19 18:15:31 -0800 |
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committer | Jeff Garzik <jeff@garzik.org> | 2007-02-05 16:58:47 -0500 |
commit | e4b91c484611da385e34ff0f8bb2744ae2c735b7 (patch) | |
tree | 5887acc060adf2dfe900fdcc11127156ad6b6217 /Documentation/arm | |
parent | bc63eb9c7ec0eb7b091db2d82d46d1e68ff9e231 (diff) |
bonding: fix device name allocation error
The code to select names for the bonding interfaces was, for the
non-sysfs creation case, always using a hard-coded set of bond0, bond1,
etc, up to max_bonds. This caused conflicts for the second or
subsequent loads of the module.
Changed the code to obtain device names from dev_alloc_name().
Signed-off-by: Jay Vosburgh <fubar@us.ibm.com>
Signed-off-by: Jeff Garzik <jeff@garzik.org>
Diffstat (limited to 'Documentation/arm')
0 files changed, 0 insertions, 0 deletions