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authorJay Vosburgh <fubar@us.ibm.com>2007-01-19 18:15:31 -0800
committerJeff Garzik <jeff@garzik.org>2007-02-05 16:58:47 -0500
commite4b91c484611da385e34ff0f8bb2744ae2c735b7 (patch)
tree5887acc060adf2dfe900fdcc11127156ad6b6217 /Documentation/arm
parentbc63eb9c7ec0eb7b091db2d82d46d1e68ff9e231 (diff)
bonding: fix device name allocation error
The code to select names for the bonding interfaces was, for the non-sysfs creation case, always using a hard-coded set of bond0, bond1, etc, up to max_bonds. This caused conflicts for the second or subsequent loads of the module. Changed the code to obtain device names from dev_alloc_name(). Signed-off-by: Jay Vosburgh <fubar@us.ibm.com> Signed-off-by: Jeff Garzik <jeff@garzik.org>
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