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authorSergei Shtylyov <sshtylyov@ru.mvista.com>2010-02-12 23:52:34 +0400
committerGreg Kroah-Hartman <gregkh@suse.de>2010-03-02 14:55:06 -0800
commitefe7daf2231a6beb59f0f641461d19fa62fb83ab (patch)
tree615fdbfb7928e5deee4f5051bf21246c433a9a26 /firmware/tigon/tg3.bin.ihex
parentbdee2d8432f5af5af953896182a59ec1c5d6fa3a (diff)
USB: OHCI: DA8xx/OMAP-L1x glue layer
Texas Instruments DA8xx/OMAP-L1x OHCI glue layer. This OHCI implementation is not without quirks: there's only one physical port despite the root hub reporting two; the port's power control and over-current status bits are not connected to any pins, however, at least on the DA830 EVM board, those signals are connected via GPIO, thus the provision was made for overriding the OHCI port power and over-current bits at the board level... Signed-off-by: Mikhail Cherkashin <mcherkashin@ru.mvista.com> Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com> Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
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